hisense A9 Pro lwn hmd Fusion

Sepintas lalu

Jenama: HiSense; HMD
Tarikh keluaran: Mac 2023, 3 tahun 4 bulan lalu; September 2024, 1 tahun 10 bulan lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 456.552 Antutu v10 Overall performance better than 72% of devices

Saiz: 6.1"; 6.56"
Resolusi: 824 x 1648 px FHD; 720 x 1612 px HD+
Jenis: eInk E INK Carta 1200; LCD IPS
Ketumpatan: 302 ppi High Density; 269 ppi Medium Density
Nisbah aspek: 18:9; 20:9
Ciri: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Peak brightness - 600 cd/m², Brightnes 480 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Frameless

Cipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 4 Gen 2 (SM4450)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz Cortex A76 +6x 2.0 GHz Cortex A55
Jenis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 4 nm
Frekuensi: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Qualcomm Adreno
RAM: 8 GB; 6 GB
64-bit: Yes; Yes
Jenis RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 108 Mpx
Aperture: Unknow; Unknow
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; Yes, 120 fps
Ciri: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasiti: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jenis: —; UFS Storage 2.2

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.5 mm 164.2 mm 8.3 mm Print 3D Model
Berat: 183 g; 203 g
Bahan: Plastic; Plastic
Warna: Black; Black
Permukaan boleh guna: 76 %; 83 %
Kalis air/habuk: —; IP54
Kalis jatuh: —; Class A B C D E 270 drops without defects
Kebolehbaikan: —; Class A B C D E

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services
Kemas kini: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, Apt-x Adaptive
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B32 (1500), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)