hisense A9 Pro lwn iiif150 Air1

Sepintas lalu

Jenama: HiSense; iiiF150
Tarikh keluaran: Mac 2023, 3 tahun 4 bulan lalu; Julai 2022, 4 tahun lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 135.000 Antutu v9 Overall performance better than 53% of devices

Saiz: 6.1"; 6.5"
Resolusi: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Jenis: eInk E INK Carta 1200; LCD IPS
Ketumpatan: 302 ppi High Density; 405 ppi Very high density
Nisbah aspek: 18:9; 20:9
Ciri: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, LED Notifications, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Cipset: Qualcomm Snapdragon 662; MediaTek Helio P35 MT6765
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A53 2.3 GHz + 4x Cortex A53 1.8 GHz
Jenis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 14 nm
Frekuensi: 2 GHz; 2.3 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8320
RAM: 8 GB; 6 GB
64-bit: Yes; Yes

Resolusi: 13 Mpx; 20 Mpx
Aperture: Unknow; ƒ/ 1.8
Denyar: LED; Triple LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasiti: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.6 mm 171.0 mm 11.3 mm Print 3D Model
Berat: 183 g; 272 g
Bahan: Plastic; Rugged Smartphone, Polycarbonate , Titanium
Warna: Black; Black Orange
Permukaan boleh guna: 76 %; 73 %
Kalis air/habuk: —; IP68, MIL-STD-810G , IP69

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 11 Red Velvet Cake Android 11
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)