hisense A9 Pro vs hotwav T7S

Sakilas

Merek: HiSense; Hotwav
Tanggal rilis: Maret 2023, 3 taun 4 sasi kepungkur; Januari 2025, 1 taun 6 sasi kepungkur
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Ukuran: 6.1"; 6.52"
Resolusi: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Jinis: eInk E INK Carta 1200; LCD IPS
Kepadhetan: 302 ppi High Density; 407 ppi Very high density
Rasio aspek: 18:9; 21:9
Fitur: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek MT8788V
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Jinis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 12 nm
Frekuensi: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Mali-G72 MP3
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
Jinis RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 21 Mpx
Aperture: Unknow; Unknow
Flash: LED; LED
Stabilisasi optik: No; No
Gerak alon: No, 30 fps; No, 30 fps
Fitur: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Kapasitas: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jinis: —; eMMC 5.1 Storage

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Bobot: 183 g; 310 g
Bahan: Plastic; Rugged Smartphone, Plastic , Faux leather
Warna: Black; Black Green
Permukaan sing bisa dianggo: 76 %; 71 %
Tahan banyu/bledug: —; IP68, IP69 , MIL-STD-810H
Tahan tiba: —; Class A B C D E 270 drops without defects
Kemampuan ndandani: —; Class A B C D E

Sistem operasi: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Layanan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)