hisense A9 Pro vs iiif150 Air1

Sakilas

Merek: HiSense; iiiF150
Tanggal rilis: Maret 2023, 3 taun 4 sasi kepungkur; Juli 2022, 4 taun kepungkur
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 135.000 Antutu v9 Overall performance better than 53% of devices

Ukuran: 6.1"; 6.5"
Resolusi: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Jinis: eInk E INK Carta 1200; LCD IPS
Kepadhetan: 302 ppi High Density; 405 ppi Very high density
Rasio aspek: 18:9; 20:9
Fitur: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, LED Notifications, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Helio P35 MT6765
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4x Cortex A53 2.3 GHz + 4x Cortex A53 1.8 GHz
Jinis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 14 nm
Frekuensi: 2 GHz; 2.3 GHz
GPU: Qualcomm Adreno 610; PowerVR GE8320
RAM: 8 GB; 6 GB
64-bit: Yes; Yes

Resolusi: 13 Mpx; 20 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; Triple LED
Stabilisasi optik: No; No
Gerak alon: No, 30 fps; No, 30 fps
Fitur: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasitas: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 81.6 mm 171.0 mm 11.3 mm Print 3D Model
Bobot: 183 g; 272 g
Bahan: Plastic; Rugged Smartphone, Polycarbonate , Titanium
Warna: Black; Black Orange
Permukaan sing bisa dianggo: 76 %; 73 %
Tahan banyu/bledug: —; IP68, MIL-STD-810G , IP69

Sistem operasi: Android 12 Snow Cone Android 12; Android 11 Red Velvet Cake Android 11
Layanan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)