hotwav T7S vs Samsung Galaxy XCover 7

At a glance

Brand: Hotwav; Samsung
Release date: January 2025, 1 years 5 months ago; January 2024, 2 years 5 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 401.000 Antutu v10 Overall performance better than 65% of devices

Size: 6.52"; 6.6"
Resolution: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Type: LCD IPS; TFT LCD (IPS)
Density: 407 ppi Very high density; 418 ppi Very high density
Aspect ratio: 21:9; 20:9
Features: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Water Drop Notch, Scratch resistant, Corning Gorilla Glass Victus+, Capacitive, Multi-touch

Chipset: MediaTek MT8788V; MediaTek Dimensity 6100+
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x2.2 GHz ARM Cortex A76 +6x2.0 GHz ARM Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; ARM Mali-G57 MC2
RAM: 4 GB; 6 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 21 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Sensor: Sony Exmor; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 80.1 mm 169.0 mm 10.2 mm Print 3D Model
Weight: 310 g; 240 g
Materials: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Polycarbonate
Colors: Black Green; Black
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 78 %

Operating system: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services
Updates: —; OS updates: 2 years, Security updates: 4 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + eSIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.2 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi MiMO
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)