hotwav T7S vs iiif150 Action 15

At a glance

Brand: Hotwav; iiiF150
Release date: January 2025, 1 years 4 months ago; October 2025, 7 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 239.545 Antutu v10 Overall performance better than 57% of devices

Size: 6.52"; 6.67"
Resolution: 1080 x 2460 px FHD+; 720 x 1640 px HD+
Type: LCD IPS; LCD IPS
Density: 407 ppi Very high density; 269 ppi Medium Density
Aspect ratio: 21:9; 21:9
Features: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, Brightnes 500 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell

Chipset: MediaTek MT8788V; MediaTek Helio G81 (MT6769)
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.7 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; ARM Mali-G52 MC2
RAM: 4 GB; 6 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 21 Mpx; 48 Mpx
Aperture: Unknow; ƒ/ 1.8
Sensor: Sony Exmor; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 256 GB
Type: eMMC 5.1 Storage; —
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.6 mm 166.6 mm 7.9 mm Print 3D Model
Weight: 310 g; 203 g
Materials: Rugged Smartphone, Plastic , Faux leather; Plastic
Colors: Black Green; Black White Green
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 82 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)