hisense E60 Lite vs hotwav T7 Pro

At a glance

Brand: HiSense; Hotwav
Release date: April 2022, 4 years 2 months ago; June 2024, 2 years ago
AnTuTu: 121.300 Antutu v9 Overall performance better than 52% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.52"; 6.6"
Resolution: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 269 ppi Medium Density; 407 ppi Very high density
Aspect ratio: 21:9; 21:9
Features: Water Drop Notch, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863A; MediaTek MT8788V
CPU: 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 28 nm; 12 nm
Frequency: 1.6 GHz; 2 GHz
GPU: PowerVR GE8322; Mali-G72 MP3
RAM: 2 GB; 6 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 13 Mpx; 64 Mpx
Aperture: Unknow; Unknow
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 64 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 76.7 mm 166.0 mm 9.7 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 199 g; 292 g
Materials: Plastic; Rugged Smartphone, Plastic , Faux leather
Colors: Blue Gray; Black Orange
Usable surface: 80 %; 71 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 11 Red Velvet Cake Android 11 Go edition; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11b , 802.11g , 802.11n , 802.11n 5GHz; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B12 (700), B26 (850), B28b (700), B28a (700); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)