blu B9 vs hotwav T7 Pro

At a glance

Brand: BLU; Hotwav
Release date: April 2022, 4 years 1 months ago; June 2024, 1 years 11 months ago
AnTuTu: 104.325 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.52"; 6.6"
Resolution: 720 x 1600 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 264 ppi Medium Density; 407 ppi Very high density
Aspect ratio: 20:9; 21:9
Features: Water Drop Notch, Max brightness HBM - 480 cd/m², Scratch resistant, Corning Gorilla Glass 3, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Spreadtrum Unisoc SC9863; MediaTek MT8788V
CPU: 4x Cortex A55 1.3 GHz + 4x Cortex A55 1.2 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 28 nm; 12 nm
Frequency: 1.3 GHz; 2 GHz
GPU: PowerVR GE8322; Mali-G72 MP3
RAM: 4 GB; 6 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 13 Mpx; 64 Mpx
Aperture: ƒ/ 2.2; Unknow
Pixel size: 1.12 µm; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: Yes, 90 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 256 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 75.9 mm 164.4 mm 9.6 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 198 g; 292 g
Materials: Plastic; Rugged Smartphone, Plastic , Faux leather
Colors: Blue Gray; Black Orange
Usable surface: 80 %; 71 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 11 Red Velvet Cake Android 11; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 4.2 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11b , 802.11g , 802.11n; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot, Wi-Fi Direct; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)