Cubot X70 vs hotwav T7S

Genel bakış

Marka: Cubot; Hotwav
Çıkış tarihi: Mayıs 2023, 3 yıl 2 ay önce; Ocak 2025, 1 yıl 6 ay önce
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Boyut: 6.58"; 6.52"
Çözünürlük: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tür: LCD IPS; LCD IPS
Yoğunluk: 401 ppi Very high density; 407 ppi Very high density
En/boy oranı: 20:9; 21:9
Özellikler: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Yonga seti: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU türü: Octa-Core; Octa-Core
Üretim süreci: 6 nm; 12 nm
Frekans: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 12 GB; 4 GB
RAM türü: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Çözünürlük: 100 Mpx; 21 Mpx
Diyafram: Unknow; Unknow
Piksel boyutu: 0.80 µm; —
Flaş: LED; LED
Optik sabitleme: No; No
Ağır çekim: No, 30 fps; No, 30 fps
Özellikler: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensör: —; Sony Exmor

Kapasite: 256 GB; 128 GB
SD yuvası: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tür: —; eMMC 5.1 Storage

Boyutlar: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Ağırlık: 220 g; 310 g
Malzemeler: Metal; Rugged Smartphone, Plastic , Faux leather
Renkler: Black Aurora Black; Black Green
Kullanılabilir alan: 83 %; 71 %
Su/toz dayanımı: —; IP68, IP69 , MIL-STD-810H
Düşme dayanımı: —; Class A B C D E 270 drops without defects
Onarılabilirlik: —; Class A B C D E

İşletim sistemi: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google hizmetleri: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Bluetooth profilleri: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi özellikleri: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB özellikleri: Charging, OTG; Charging, OTG
Navigasyon: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)