hotwav T7S vs lava O3

Resumo

Marca: Hotwav; Lava
Data de lançamento: janeiro de 2025, há 1 anos e 6 meses; setembro de 2024, há 1 anos e 10 meses
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 154.110 Antutu v10 Overall performance better than 54% of devices

Tamanho: 6.52"; 6.75"
Resolução: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Tipo: LCD IPS; LCD IPS
Densidade: 407 ppi Very high density; 260 ppi Medium Density
Proporção: 21:9; 20:9
Recursos: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Processador: MediaTek MT8788V; Spreadtrum Unisoc SC9863A
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 28 nm
Frequência: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; PowerVR GE8322
RAM: 4 GB; 3 GB
Tipo de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Resolução: 21 Mpx; 13 Mpx
Abertura: Unknow; Unknow
Sensor: Sony Exmor; —
Flash: LED; Dual LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensões: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.1 mm 164.9 mm 8.8 mm Print 3D Model
Peso: 310 g; 193 g
Materiais: Rugged Smartphone, Plastic , Faux leather; Plastic
Cores: Black Green; Black White Violet
Resistência à água e poeira: IP68, IP69 , MIL-STD-810H; IP54
Resistência a quedas: Class A B C D E 270 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 71 %; 87 %

Sistema operacional: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 4.2
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B8 (900), B28b (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)