hisense A9 Pro vs Ulefone Rugking 2 Pro

Resumo

Marca: HiSense; Ulefone
Data de lançamento: março de 2023, há 3 anos e 4 meses; novembro de 2025, há 8 meses
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 305.000 Antutu v10 Overall performance better than 61% of devices

Tamanho: 6.1"; 5.45"
Resolução: 824 x 1648 px FHD; 720 x 1440 px HD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densidade: 302 ppi High Density; 295 ppi Medium Density
Proporção: 18:9; 18:9
Recursos: Water Drop Notch, Capacitive, Multi-touch, Frameless; Without Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Processador: Qualcomm Snapdragon 662; Unisoc Tiger T615 (T7250)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2 x ARM Cortex A75 1.8Ghz + 6 x ARM Cortex A55 1.6Ghz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 11 nm; 12 nm
Frequência: 2 GHz; 1.8 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MP1
RAM: 8 GB; 4 GB
64 bits: Yes; Yes
Tipo de RAM: —; LPDDR4X RAM

Resolução: 13 Mpx; 13 Mpx
Abertura: Unknow; ƒ/ 2.0
Flash: LED; Triple LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Hynix Hi-1333
Tamanho de pixel: —; 1.12 µm
Tamanho do sensor: —; 1/3"

Capacidade: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; UFS Storage 2.1

Dimensões: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.0 mm 176.3 mm 18.0 mm Print 3D Model
Peso: 183 g; 254 g
Materiais: Plastic; Rugged Smartphone, Polycarbonate
Cores: Black; Black Green Orange
Superfície útil: 76 %; 53 %
Resistência à água e poeira: —; IP68, IP69 , MIL-STD-810H
Resistência a quedas: —; Class A B C D E 270 drops without defects
Reparabilidade: —; Class A B C D E

Sistema operacional: Android 12 Snow Cone Android 12; Android 15 Android 15
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)