hisense A9 Pro vs hotwav T7 Pro

Resumo

Marca: HiSense; Hotwav
Data de lançamento: março de 2023, há 3 anos e 4 meses; junho de 2024, há 2 anos e 1 meses
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Tamanho: 6.1"; 6.6"
Resolução: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densidade: 302 ppi High Density; 407 ppi Very high density
Proporção: 18:9; 21:9
Recursos: Water Drop Notch, Capacitive, Multi-touch, Frameless; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Processador: Qualcomm Snapdragon 662; MediaTek MT8788V
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 11 nm; 12 nm
Frequência: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Mali-G72 MP3
RAM: 8 GB; 6 GB
64 bits: Yes; Yes
Tipo de RAM: —; LPDDR4X RAM

Resolução: 13 Mpx; 64 Mpx
Abertura: Unknow; Unknow
Flash: LED; LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidade: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensões: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 183 g; 292 g
Materiais: Plastic; Rugged Smartphone, Plastic , Faux leather
Cores: Black; Black Orange
Superfície útil: 76 %; 71 %
Resistência à água e poeira: —; IP68, IP69 , MIL-STD-810H
Resistência a quedas: —; Class A B C D E 270 drops without defects
Reparabilidade: —; Class A B C D E

Sistema operacional: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)