Cubot X70 vs iiif150 B3

Resumo

Marca: Cubot; iiiF150
Data de lançamento: maio de 2023, há 3 anos e 2 meses; outubro de 2024, há 1 anos e 9 meses
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 420.000 Antutu v10 Overall performance better than 69% of devices

Tamanho: 6.58"; 6.6"
Resolução: 1080 x 2408 px FHD+; 1080 x 2400 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 401 ppi Very high density; 399 ppi High Density
Proporção: 20:9; 21:9
Recursos: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Hole-punch Notch, Refresh rate 120 Hz, Color LED Notifications, Corning Gorilla Glass 5, Capacitive, Multi-touch

Processador: MediaTek Helio G99 (MT6789); MediaTek Helio G96
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x Cortex A76 2.05 GHz + 6x Cortex A55 2.0 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 6 nm; 12 nm
Frequência: 2.2 GHz; 2.05 GHz
GPU: Mali-G57 MC2; ARM Mali-G57 MC2 900MHz
RAM: 12 GB; 8 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 100 Mpx; 108 Mpx
Abertura: Unknow; ƒ/ 1.8
Tamanho de pixel: 0.80 µm; —
Flash: LED; Triple LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung

Capacidade: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; UFS Storage 2.2

Dimensões: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Peso: 220 g; 336 g
Materiais: Metal; TPU , Rugged Smartphone, Titanium-aluminium alloy
Cores: Black Aurora Black; Black Orange
Superfície útil: 83 %; 78 %
Resistência à água e poeira: —; IP68, IP69 , MIL-STD-810H
Resistência a quedas: —; Class A B C D E 270 drops without defects
Reparabilidade: —; Class A B C D E

Sistema operacional: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)