Cubot X70 vs hotwav T7S

Resumo

Marca: Cubot; Hotwav
Data de lançamento: maio de 2023, há 3 anos e 2 meses; janeiro de 2025, há 1 anos e 6 meses
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Tamanho: 6.58"; 6.52"
Resolução: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 401 ppi Very high density; 407 ppi Very high density
Proporção: 20:9; 21:9
Recursos: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Processador: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 6 nm; 12 nm
Frequência: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 12 GB; 4 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 100 Mpx; 21 Mpx
Abertura: Unknow; Unknow
Tamanho de pixel: 0.80 µm; —
Flash: LED; LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacidade: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensões: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 220 g; 310 g
Materiais: Metal; Rugged Smartphone, Plastic , Faux leather
Cores: Black Aurora Black; Black Green
Superfície útil: 83 %; 71 %
Resistência à água e poeira: —; IP68, IP69 , MIL-STD-810H
Resistência a quedas: —; Class A B C D E 270 drops without defects
Reparabilidade: —; Class A B C D E

Sistema operacional: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)