Cubot Kingkong Mini 4 vs hisense A9 Pro

Resumo

Marca: Cubot; HiSense
Data de lançamento: novembro de 2025, há 8 meses; março de 2023, há 3 anos e 4 meses
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Tamanho: 4.7"; 6.1"
Resolução: 720 x 1600 px HD+; 824 x 1648 px FHD
Tipo: LCD IPS; eInk E INK Carta 1200
Densidade: 373 ppi High Density; 302 ppi High Density
Proporção: 20:9; 18:9
Recursos: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Water Drop Notch, Capacitive, Multi-touch, Frameless

Processador: Unisoc Tiger T616; Qualcomm Snapdragon 662
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 11 nm
Frequência: 2 GHz; 2 GHz
GPU: Mali-G57 MP1; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
Tipo de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Resolução: 48 Mpx; 13 Mpx
Abertura: ƒ/ 1.8; Unknow
Flash: LED; LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidade: 128 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensões: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Peso: 192 g; 183 g
Materiais: Rugged Smartphone, Polycarbonate; Plastic
Cores: Black Red Green Orange; Black
Resistência à água e poeira: IP68, MIL-STD-810G , IP69; —
Resistência a quedas: Class A B C D E 270 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 68 %; 76 %

Sistema operacional: Android 15 Android 15; Android 12 Snow Cone Android 12
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)