hisense A9 Pro vs hotwav W11

W skrócie

Marka: HiSense; Hotwav
Data premiery: marzec 2023, 3 lat 4 miesięcy temu; marzec 2024, 2 lat 4 miesięcy temu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 260.000 Antutu v10 Overall performance better than 60% of devices

Rozmiar: 6.1"; 6.6"
Rozdzielczość: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Typ: eInk E INK Carta 1200; LCD IPS
Gęstość: 302 ppi High Density; 407 ppi Very high density
Proporcje ekranu: 18:9; 20:9
Funkcje: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Brightnes 380 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Procesor: Qualcomm Snapdragon 662; MediaTek MT8788V
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Typ CPU: Octa-Core; Octa-Core
Proces: 11 nm; 12 nm
Częstotliwość: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Mali-G72 MP3
RAM: 8 GB; 6 GB
64-bit: Yes; Yes
Typ RAM: —; LPDDR4X RAM

Rozdzielczość: 13 Mpx; 64 Mpx
Przysłona: Unknow; ƒ/ 1.8
Lampa błyskowa: LED; Dual LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; No, 30 fps
Funkcje: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Matryca: —; Sony IMX686 Exmor RS
Wielkość piksela: —; 0.80 µm
Rozmiar matrycy: —; 1/1.7"

Pojemność: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; UFS Storage 2.1

Wymiary: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.8 mm 176.6 mm 26.5 mm Print 3D Model
Waga: 183 g; 563 g
Materiały: Plastic; Rugged Smartphone, Polycarbonate
Kolory: Black; Gray Orange
Powierzchnia użytkowa: 76 %; 70 %
Odporność na wodę/pył: —; IP68, MIL-STD-810G , IP69

System operacyjny: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Usługi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 4.2 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)