hisense A9 Pro vs hmd Fusion

W skrócie

Marka: HiSense; HMD
Data premiery: marzec 2023, 3 lat 4 miesięcy temu; wrzesień 2024, 1 lat 10 miesięcy temu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 456.552 Antutu v10 Overall performance better than 72% of devices

Rozmiar: 6.1"; 6.56"
Rozdzielczość: 824 x 1648 px FHD; 720 x 1612 px HD+
Typ: eInk E INK Carta 1200; LCD IPS
Gęstość: 302 ppi High Density; 269 ppi Medium Density
Proporcje ekranu: 18:9; 20:9
Funkcje: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Peak brightness - 600 cd/m², Brightnes 480 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Frameless

Procesor: Qualcomm Snapdragon 662; Qualcomm Snapdragon 4 Gen 2 (SM4450)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz Cortex A76 +6x 2.0 GHz Cortex A55
Typ CPU: Octa-Core; Octa-Core
Proces: 11 nm; 4 nm
Częstotliwość: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Qualcomm Adreno
RAM: 8 GB; 6 GB
64-bit: Yes; Yes
Typ RAM: —; LPDDR4X RAM

Rozdzielczość: 13 Mpx; 108 Mpx
Przysłona: Unknow; Unknow
Lampa błyskowa: LED; LED
Stabilizacja optyczna: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Funkcje: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Pojemność: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Typ: —; UFS Storage 2.2

Wymiary: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.5 mm 164.2 mm 8.3 mm Print 3D Model
Waga: 183 g; 203 g
Materiały: Plastic; Plastic
Kolory: Black; Black
Powierzchnia użytkowa: 76 %; 83 %
Odporność na wodę/pył: —; IP54
Odporność na upadki: —; Class A B C D E 270 drops without defects
Naprawialność: —; Class A B C D E

System operacyjny: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Usługi Google: With Google Mobile Services; With Google Mobile Services
Aktualizacje: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profile Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, Apt-x Adaptive
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funkcje Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funkcje USB: Charging, OTG; Charging, OTG
Nawigacja: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B32 (1500), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)