hisense A9 Pro lwn Vivo Y03

Sepintas lalu

Jenama: HiSense; vivo
Tarikh keluaran: Mac 2023, 3 tahun 4 bulan lalu; Mac 2024, 2 tahun 4 bulan lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 222.000 Antutu v10 Overall performance better than 56% of devices

Saiz: 6.1"; 6.56"
Resolusi: 824 x 1648 px FHD; 720 x 1612 px HD+
Jenis: eInk E INK Carta 1200; LCD IPS
Ketumpatan: 302 ppi High Density; 270 ppi Medium Density
Nisbah aspek: 18:9; 20:9
Ciri: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 90 Hz, Max brightness HBM - 500 cd/m², TÜV Rheinland Eye Comfort Certification, 70% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Cipset: Qualcomm Snapdragon 662; MediaTek Helio G85 (MT6769V/CZ)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Jenis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 12 nm
Frekuensi: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 950MHz
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
Jenis RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.2
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; Yes, 120 fps
Ciri: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.7 mm 163.8 mm 8.4 mm Print 3D Model
Berat: 183 g; 185 g
Bahan: Plastic; Plastic , Splash resistant design
Warna: Black; Black Green
Permukaan boleh guna: 76 %; 83 %
Kalis air/habuk: —; IP54

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Funtouch OS 14 (Android 14)
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services
Kemas kini: —; OS updates: 1 years, Security updates: 2 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B8 (900), B40 (TDD 2300)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B5 (850), B8 (900)