hisense A9 Pro lwn realme 11 5G

Sepintas lalu

Jenama: HiSense; realme
Tarikh keluaran: Mac 2023, 3 tahun 4 bulan lalu; Julai 2023, 3 tahun lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 442.599 Antutu v10 Overall performance better than 70% of devices

Saiz: 6.1"; 6.72"
Resolusi: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Jenis: eInk E INK Carta 1200; LCD IPS
Ketumpatan: 302 ppi High Density; 392 ppi High Density
Nisbah aspek: 18:9; 20:9
Ciri: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Touch sampling rate 240 Hz, Brightnes 550 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Cipset: Qualcomm Snapdragon 662; MediaTek Dimensity 6100+
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz ARM Cortex A76 +6x2.0 GHz ARM Cortex A55
Jenis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 6 nm
Frekuensi: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57 MC2
RAM: 8 GB; 8 GB
64-bit: Yes; Yes
Jenis RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.75
Denyar: LED; LED
Penstabilan optik: No; Yes
Gerak perlahan: No, 30 fps; Yes, 240 fps
Ciri: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Optical Stabilization (OIS), Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia: —; Samsung HM6
Saiz piksel: —; 0.64 µm
Saiz penderia: —; 1/1.67"

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.0 mm 165.7 mm 8.1 mm Print 3D Model
Berat: 183 g; 190 g
Bahan: Plastic; Plastic
Warna: Black; Black Gold
Permukaan boleh guna: 76 %; 86 %
Kalis jatuh: —; Class A B C D E 270 drops without defects
Kebolehbaikan: —; Class A B C D E

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 13 Tiramisu RealmeUI 4.0 (Android 13)
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services
Kemas kini: —; OS updates: 2 years, Security updates: 3 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n66 (1700), n77 (3700), n78 (3500)