hisense A9 Pro lwn iiif150 Action 15 Pro

Sepintas lalu

Jenama: HiSense; iiiF150
Tarikh keluaran: Mac 2023, 3 tahun 4 bulan lalu; Oktober 2025, 9 bulan lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 401.000 Antutu v10 Overall performance better than 65% of devices

Saiz: 6.1"; 6.78"
Resolusi: 824 x 1648 px FHD; 1080 x 2400 px FHD+
Jenis: eInk E INK Carta 1200; AMOLED
Ketumpatan: 302 ppi High Density; 388 ppi High Density
Nisbah aspek: 18:9; 20:9
Ciri: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 120 Hz, Brightnes 500 cd/m² (typ), 2.5D curved glass screen, Dual Edge display, Capacitive, Multi-touch, Frameless, In-cell

Cipset: Qualcomm Snapdragon 662; MediaTek Helio G100
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2GHz Cortex A76 + 6x2GHz Cortex A55
Jenis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 6 nm
Frekuensi: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G57 MC2
RAM: 8 GB; 8 GB
64-bit: Yes; Yes

Resolusi: 13 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.9
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia: —; Sony IMX766
Saiz piksel: —; 1.00 µm
Saiz penderia: —; 1/1.56"

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 74.6 mm 164.6 mm 6.9 mm Print 3D Model
Berat: 183 g; 177 g
Bahan: Plastic; Plastic
Warna: Black; Black White
Permukaan boleh guna: 76 %; 90 %
Kalis air/habuk: —; IP68, IP69 , MIL-STD-810H
Kalis jatuh: —; Class A B C D E 270 drops without defects
Kebolehbaikan: —; Class A B C D E

Sistem pengendalian: Android 12 Snow Cone Android 12; Android 15 Android 15
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)