Cubot X70 lwn hotwav T7

Sepintas lalu

Jenama: Cubot; Hotwav
Tarikh keluaran: Mei 2023, 3 tahun 2 bulan lalu; Julai 2024, 2 tahun lalu
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Saiz: 6.58"; 6.6"
Resolusi: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Jenis: LCD IPS; LCD IPS
Ketumpatan: 401 ppi Very high density; 407 ppi Very high density
Nisbah aspek: 20:9; 21:9
Ciri: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Cipset: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Jenis CPU: Octa-Core; Octa-Core
Proses: 6 nm; 12 nm
Frekuensi: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 12 GB; 4 GB
Jenis RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolusi: 100 Mpx; 21 Mpx
Aperture: Unknow; Unknow
Saiz piksel: 0.80 µm; —
Denyar: LED; LED
Penstabilan optik: No; No
Gerak perlahan: No, 30 fps; No, 30 fps
Ciri: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Penderia: —; Sony Exmor

Kapasiti: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jenis: —; eMMC 5.1 Storage

Dimensi: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Berat: 220 g; 292 g
Bahan: Metal; Rugged Smartphone, Plastic , Faux leather
Warna: Black Aurora Black; Black Orange
Permukaan boleh guna: 83 %; 71 %
Kalis air/habuk: —; IP68, IP69 , MIL-STD-810H

Sistem pengendalian: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Perkhidmatan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Ciri Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Ciri USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)