hisense A9 Pro vs Ulefone Rugking 2 Pro

Sakilas

Merek: HiSense; Ulefone
Tanggal rilis: Maret 2023, 3 taun 4 sasi kepungkur; November 2025, 8 sasi kepungkur
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 305.000 Antutu v10 Overall performance better than 61% of devices

Ukuran: 6.1"; 5.45"
Resolusi: 824 x 1648 px FHD; 720 x 1440 px HD+
Jinis: eInk E INK Carta 1200; LCD IPS
Kepadhetan: 302 ppi High Density; 295 ppi Medium Density
Rasio aspek: 18:9; 18:9
Fitur: Water Drop Notch, Capacitive, Multi-touch, Frameless; Without Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T615 (T7250)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2 x ARM Cortex A75 1.8Ghz + 6 x ARM Cortex A55 1.6Ghz
Jinis CPU: Octa-Core; Octa-Core
Proses: 11 nm; 12 nm
Frekuensi: 2 GHz; 1.8 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MP1
RAM: 8 GB; 4 GB
64-bit: Yes; Yes
Jinis RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.0
Flash: LED; Triple LED
Stabilisasi optik: No; No
Gerak alon: No, 30 fps; No, 30 fps
Fitur: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Hynix Hi-1333
Ukuran piksel: —; 1.12 µm
Ukuran sensor: —; 1/3"

Kapasitas: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Jinis: —; UFS Storage 2.1

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.0 mm 176.3 mm 18.0 mm Print 3D Model
Bobot: 183 g; 254 g
Bahan: Plastic; Rugged Smartphone, Polycarbonate
Warna: Black; Black Green Orange
Permukaan sing bisa dianggo: 76 %; 53 %
Tahan banyu/bledug: —; IP68, IP69 , MIL-STD-810H
Tahan tiba: —; Class A B C D E 270 drops without defects
Kemampuan ndandani: —; Class A B C D E

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)