hisense A9 Pro vs Unihertz Tank Mini

In sintesi

Marca: HiSense; Unihertz
Data di uscita: marzo 2023, 3 anni e 4 mesi fa; gennaio 2024, 2 anni e 6 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 420.000 Antutu v10 Overall performance better than 69% of devices

Dimensione: 6.1"; 4.3"
Risoluzione: 824 x 1648 px FHD; 540 x 1200 px LowRes
Tipo: eInk E INK Carta 1200; LCD IPS
Densità: 302 ppi High Density; 306 ppi High Density
Rapporto d’aspetto: 18:9; 20:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Touch sampling rate 120 Hz, Panda glass, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G99 (MT6789)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 6 nm
Frequenza: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MC2
RAM: 8 GB; 12 GB
64 bit: Yes; Yes
Tipo di RAM: —; LPDDR4X RAM

Risoluzione: 13 Mpx; 108 Mpx
Apertura: Unknow; ƒ/ 1.75
Flash: LED; Dual LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 58.8 mm 120.7 mm 23.3 mm Print 3D Model
Peso: 183 g; 240 g
Materiali: Plastic; Rugged Smartphone, Metal
Colori: Black; Black
Superficie utile: 76 %; 63 %
Resistenza ad acqua/polvere: —; IP68, MIL-STD-810H
Resistenza alle cadute: —; Class A B C D E 180 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), HS
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), B2 (1900), B3 (1800), B5 (850), B8 (900)