hisense A9 Pro vs hmd Fusion

In sintesi

Marca: HiSense; HMD
Data di uscita: marzo 2023, 3 anni e 4 mesi fa; settembre 2024, 1 anni e 10 mesi fa
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 456.552 Antutu v10 Overall performance better than 72% of devices

Dimensione: 6.1"; 6.56"
Risoluzione: 824 x 1648 px FHD; 720 x 1612 px HD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densità: 302 ppi High Density; 269 ppi Medium Density
Rapporto d’aspetto: 18:9; 20:9
Caratteristiche: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Peak brightness - 600 cd/m², Brightnes 480 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Frameless

Chipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 4 Gen 2 (SM4450)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz Cortex A76 +6x 2.0 GHz Cortex A55
Tipo di CPU: Octa-Core; Octa-Core
Processo: 11 nm; 4 nm
Frequenza: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Qualcomm Adreno
RAM: 8 GB; 6 GB
64 bit: Yes; Yes
Tipo di RAM: —; LPDDR4X RAM

Risoluzione: 13 Mpx; 108 Mpx
Apertura: Unknow; Unknow
Flash: LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Caratteristiche: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacità: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; UFS Storage 2.2

Dimensioni: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.5 mm 164.2 mm 8.3 mm Print 3D Model
Peso: 183 g; 203 g
Materiali: Plastic; Plastic
Colori: Black; Black
Superficie utile: 76 %; 83 %
Resistenza ad acqua/polvere: —; IP54
Resistenza alle cadute: —; Class A B C D E 270 drops without defects
Riparabilità: —; Class A B C D E

Sistema operativo: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Servizi Google: With Google Mobile Services; With Google Mobile Services
Aggiornamenti: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, Apt-x Adaptive
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B32 (1500), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)