Cubot KingKong Star 2 vs hisense A9 Pro

In sintesi

Marca: Cubot; HiSense
Data di uscita: ottobre 2024, 1 anni e 9 mesi fa; marzo 2023, 3 anni e 4 mesi fa
AnTuTu: 990.000 Antutu v10 Overall performance better than 84% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Dimensione: 6.72"; 6.1"
Risoluzione: 1080 x 2400 px FHD+; 824 x 1648 px FHD
Tipo: LCD IPS; eInk E INK Carta 1200
Densità: 392 ppi High Density; 302 ppi High Density
Rapporto d’aspetto: 20:9; 18:9
Caratteristiche: Water Drop Notch, Refresh rate 144 Hz, Peak brightness - 1500 cd/m², Corning Gorilla Glass, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: MediaTek Dimensity 8200 (MT6896); Qualcomm Snapdragon 662
CPU: 1x Cortex A78 3.1 GHz + 3x Cortex A78 3.0 GHz + 4x Cortex A55 2.0 GHz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Tipo di CPU: Octa-Core; Octa-Core
Processo: 4 nm; 11 nm
Frequenza: 3.1 GHz; 2 GHz
GPU: Arm Mali-G610 MC6; Qualcomm Adreno 610
RAM: 12 GB; 8 GB
Tipo di RAM: RAM LPDDR5; —
64 bit: Yes; Yes

Risoluzione: 100 Mpx; 13 Mpx
Apertura: Unknow; Unknow
Dimensione pixel: 0.80 µm; —
Flash: Dual LED; LED
Stabilizzazione ottica: No; No
Slow motion: No, 30 fps; No, 30 fps
Caratteristiche: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer, Night Vision; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensioni: 81.8 mm 177.7 mm 13.5 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Peso: 305 g; 183 g
Materiali: Rugged Smartphone, Metal; Plastic
Colori: Black Red; Black
Resistenza ad acqua/polvere: IP68, IP69 , MIL-STD-810H; —
Resistenza alle cadute: Class A B C D E 270 drops without defects; —
Riparabilità: Class A B C D E; —
Superficie utile: 75 %; 76 %

Sistema operativo: Android 14 Upside-down cake Android 14; Android 12 Snow Cone Android 12
Servizi Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1
Profili Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Funzioni Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Funzioni USB: Charging, OTG; Charging, OTG
Navigazione: GPS, A-GPS, GLONASS, Beidou, Galileo, GPS (L1+L5), BeiDou (B1), Galileo (E1+E5a), BeiDou (B2); GPS, A-GPS

5G: n1 (2100), n2 (1900 PCS), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n25 (1900), n28b (700), n28a (700), n38 (2600), n41 (2500), n66 (1700), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)