hisense A9 Pro vs hotwav Note 12 2024

Sekilas

Merek: HiSense; Hotwav
Tanggal rilis: Maret 2023, 3 tahun 4 bulan lalu; Oktober 2024, 1 tahun 9 bulan lalu
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 256.000 Antutu v10 Overall performance better than 60% of devices

Ukuran: 6.1"; 6.8"
Resolusi: 824 x 1648 px FHD; 720 x 1640 px HD+
Tipe: eInk E INK Carta 1200; LCD IPS
Kerapatan: 302 ppi High Density; 409 ppi Very high density
Rasio aspek: 18:9; 19.5:9
Fitur: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Max brightness HBM - 500 cd/m², 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Panda glass, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T606
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Tipe CPU: Octa-Core; Octa-Core
Proses: 11 nm; 12 nm
Frekuensi: 2 GHz; 1.6 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57
RAM: 8 GB; 6 GB
64-bit: Yes; Yes
Tipe RAM: —; LPDDR4X RAM

Resolusi: 13 Mpx; 48 Mpx
Aperture: Unknow; ƒ/ 1.8
Lampu kilat: LED; LED
Stabilisasi optik: No; No
Gerak lambat: No, 30 fps; No, 30 fps
Fitur: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Omnivision OV48B
Ukuran piksel: —; 0.80 µm
Ukuran sensor: —; 1/2"

Kapasitas: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipe: —; UFS Storage 2.2

Dimensi: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 78.0 mm 173.0 mm 8.9 mm Print 3D Model
Berat: 183 g; 220 g
Bahan: Plastic; Rugged Smartphone, Polycarbonate
Warna: Black; Black Purple Green
Permukaan yang dapat digunakan: 76 %; 70 %
Tahan jatuh: —; Class A B C D E 270 drops without defects
Kemudahan perbaikan: —; Class A B C D E

Sistem operasi: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Layanan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)