Cubot X70 vs hotwav T7 Pro

Sekilas

Merek: Cubot; Hotwav
Tanggal rilis: Mei 2023, 3 tahun 2 bulan lalu; Juni 2024, 2 tahun 1 bulan lalu
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Ukuran: 6.58"; 6.6"
Resolusi: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tipe: LCD IPS; LCD IPS
Kerapatan: 401 ppi Very high density; 407 ppi Very high density
Rasio aspek: 20:9; 21:9
Fitur: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek MT8788V
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipe CPU: Octa-Core; Octa-Core
Proses: 6 nm; 12 nm
Frekuensi: 2.2 GHz; 2 GHz
GPU: Mali-G57 MC2; Mali-G72 MP3
RAM: 12 GB; 6 GB
Tipe RAM: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolusi: 100 Mpx; 64 Mpx
Aperture: Unknow; Unknow
Ukuran piksel: 0.80 µm; —
Lampu kilat: LED; LED
Stabilisasi optik: No; No
Gerak lambat: No, 30 fps; No, 30 fps
Fitur: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Kapasitas: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipe: —; eMMC 5.1 Storage

Dimensi: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Berat: 220 g; 292 g
Bahan: Metal; Rugged Smartphone, Plastic , Faux leather
Warna: Black Aurora Black; Black Orange
Permukaan yang dapat digunakan: 83 %; 71 %
Tahan air/debu: —; IP68, IP69 , MIL-STD-810H
Tahan jatuh: —; Class A B C D E 270 drops without defects
Kemudahan perbaikan: —; Class A B C D E

Sistem operasi: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Layanan Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Profil Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fitur USB: Charging, OTG; Charging, OTG
Navigasi: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)