hisense A9 Pro vs Xiaomi Redmi A3x

En bref

Marque: HiSense; Xiaomi
Date de sortie: mars 2023, il y a 3 ans et 4 mois; mai 2024, il y a 2 ans et 2 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 239.000 Antutu v10 Overall performance better than 57% of devices

Taille: 6.1"; 6.7"
Résolution: 824 x 1648 px FHD; 720 x 1650 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 269 ppi Medium Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 90 Hz, Brightnes 500 cd/m² (typ), DC dimming, Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T603
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2xCortex A75 1.8GHz + 6x Cortex A55 1.6GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 12 nm
Fréquence: 2 GHz; 1.8 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MP1
RAM: 8 GB; 3 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 8 Mpx
Ouverture: Unknow; ƒ/ 2.2
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 64 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot
Type: —; eMMC 5.1 Storage

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.3 mm 8.3 mm Print 3D Model
Poids: 183 g; 199 g
Matériaux: Plastic; Glass , Leather
Couleurs: Black; Black Blue Green
Surface utile: 76 %; 82 %

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake MIUI 14 (Android 14)
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 2 years, Security updates: 3 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 4.2 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Wi-Fi Hotspot, Wi-Fi Direct
USB: USB Type-C; —
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)