hisense A9 Pro vs Ulefone Rugking 2 Pro

En bref

Marque: HiSense; Ulefone
Date de sortie: mars 2023, il y a 3 ans et 4 mois; novembre 2025, il y a 8 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 305.000 Antutu v10 Overall performance better than 61% of devices

Taille: 6.1"; 5.45"
Résolution: 824 x 1648 px FHD; 720 x 1440 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 295 ppi Medium Density
Rapport d’aspect: 18:9; 18:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Without Notch, Refresh rate 90 Hz, Color LED Notifications, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Qualcomm Snapdragon 662; Unisoc Tiger T615 (T7250)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2 x ARM Cortex A75 1.8Ghz + 6 x ARM Cortex A55 1.6Ghz
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 12 nm
Fréquence: 2 GHz; 1.8 GHz
GPU: Qualcomm Adreno 610; Mali-G57 MP1
RAM: 8 GB; 4 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 13 Mpx
Ouverture: Unknow; ƒ/ 2.0
Flash: LED; Triple LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Hynix Hi-1333
Taille de pixel: —; 1.12 µm
Taille du capteur: —; 1/3"

Capacité: 256 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.1

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 82.0 mm 176.3 mm 18.0 mm Print 3D Model
Poids: 183 g; 254 g
Matériaux: Plastic; Rugged Smartphone, Polycarbonate
Couleurs: Black; Black Green Orange
Surface utile: 76 %; 53 %
Résistance eau/poussière: —; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 12 Snow Cone Android 12; Android 15 Android 15
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.0
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)