hisense A9 Pro vs Tecno Pova 7 4G

En bref

Marque: HiSense; Tecno
Date de sortie: mars 2023, il y a 3 ans et 4 mois; juin 2025, il y a 1 ans et 1 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 410.000 Antutu v10 Overall performance better than 67% of devices

Taille: 6.1"; 6.78"
Résolution: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Type: eInk E INK Carta 1200; LCD
Densité: 302 ppi High Density; 396 ppi High Density
Rapport d’aspect: 18:9; 21:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 120 Hz, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: Qualcomm Snapdragon 662; MediaTek Helio G100
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2GHz Cortex A76 + 6x2GHz Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 6 nm
Fréquence: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G57 MC2
RAM: 8 GB; 8 GB
64 bits: Yes; Yes

Résolution: 13 Mpx; 108 Mpx
Ouverture: Unknow; Unknow
Flash: LED; Dual LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Dual camera, Digital image stabilization, Autofocus, Touch focus, Continuous autofocus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash

Capacité: 256 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Independent SD slot

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.6 mm 168.6 mm 9.3 mm Print 3D Model
Poids: 183 g; 225 g
Matériaux: Plastic; Polycarbonate
Couleurs: Black; Black Gold Silver
Surface utile: 76 %; 84 %
Résistance eau/poussière: —; IP64 , Splash resistant

Système d’exploitation: Android 12 Snow Cone Android 12; Android 15 HiOS 15 (Android 15)
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)