hisense A9 Pro vs hmd Fusion

En bref

Marque: HiSense; HMD
Date de sortie: mars 2023, il y a 3 ans et 4 mois; septembre 2024, il y a 1 ans et 10 mois
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 456.552 Antutu v10 Overall performance better than 72% of devices

Taille: 6.1"; 6.56"
Résolution: 824 x 1648 px FHD; 720 x 1612 px HD+
Type: eInk E INK Carta 1200; LCD IPS
Densité: 302 ppi High Density; 269 ppi Medium Density
Rapport d’aspect: 18:9; 20:9
Fonctions: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, Refresh rate 90 Hz, Peak brightness - 600 cd/m², Brightnes 480 cd/m² (typ), Scratch resistant, 2.5D curved glass screen, Capacitive, Frameless

Chipset: Qualcomm Snapdragon 662; Qualcomm Snapdragon 4 Gen 2 (SM4450)
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x2.2 GHz Cortex A76 +6x 2.0 GHz Cortex A55
Type de CPU: Octa-Core; Octa-Core
Gravure: 11 nm; 4 nm
Fréquence: 2 GHz; 2.2 GHz
GPU: Qualcomm Adreno 610; Qualcomm Adreno
RAM: 8 GB; 6 GB
64 bits: Yes; Yes
Type de RAM: —; LPDDR4X RAM

Résolution: 13 Mpx; 108 Mpx
Ouverture: Unknow; Unknow
Flash: LED; LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; Yes, 120 fps
Fonctions: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 128 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 75.5 mm 164.2 mm 8.3 mm Print 3D Model
Poids: 183 g; 203 g
Matériaux: Plastic; Plastic
Couleurs: Black; Black
Surface utile: 76 %; 83 %
Résistance eau/poussière: —; IP54
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 12 Snow Cone Android 12; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services
Mises à jour: —; OS updates: 5 years

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM / eSIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.1 LELow energy consumption
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy), APT-x, Apt-x Adaptive
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B32 (1500), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)
5G: —; n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n20 (800), n26 (850), n28b (700), n28a (700), n38 (2600), n40 (2300), n41 (2500), n77 (3700), n78 (3500)