Cubot X70 vs iiif150 B3

En bref

Marque: Cubot; iiiF150
Date de sortie: mai 2023, il y a 3 ans et 2 mois; octobre 2024, il y a 1 ans et 9 mois
AnTuTu: 416.900 Antutu v10 Overall performance better than 68% of devices; 420.000 Antutu v10 Overall performance better than 69% of devices

Taille: 6.58"; 6.6"
Résolution: 1080 x 2408 px FHD+; 1080 x 2400 px FHD+
Type: LCD IPS; LCD IPS
Densité: 401 ppi Very high density; 399 ppi High Density
Rapport d’aspect: 20:9; 21:9
Fonctions: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless, In-cell; Hole-punch Notch, Refresh rate 120 Hz, Color LED Notifications, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: MediaTek Helio G99 (MT6789); MediaTek Helio G96
CPU: 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz; 2x Cortex A76 2.05 GHz + 6x Cortex A55 2.0 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 6 nm; 12 nm
Fréquence: 2.2 GHz; 2.05 GHz
GPU: Mali-G57 MC2; ARM Mali-G57 MC2 900MHz
RAM: 12 GB; 8 GB
Type de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Résolution: 100 Mpx; 108 Mpx
Ouverture: Unknow; ƒ/ 1.8
Taille de pixel: 0.80 µm; —
Flash: LED; Triple LED
Stabilisation optique: No; No
Ralenti: No, 30 fps; No, 30 fps
Fonctions: Triple camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Capteur: —; Samsung

Capacité: 256 GB; 256 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; UFS Storage 2.2

Dimensions: 75.3 mm 165.1 mm 10.2 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Poids: 220 g; 336 g
Matériaux: Metal; TPU , Rugged Smartphone, Titanium-aluminium alloy
Couleurs: Black Aurora Black; Black Orange
Surface utile: 83 %; 78 %
Résistance eau/poussière: —; IP68, IP69 , MIL-STD-810H
Résistance aux chutes: —; Class A B C D E 270 drops without defects
Réparabilité: —; Class A B C D E

Système d’exploitation: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)