Cubot KingKong X vs hisense A9 Pro

En bref

Marque: Cubot; HiSense
Date de sortie: juin 2024, il y a 2 ans et 1 mois; mars 2023, il y a 3 ans et 4 mois
AnTuTu: 545.000 Antutu v10 Overall performance better than 74% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Taille: 6.58"; 6.1"
Résolution: 1080 x 2408 px FHD+; 824 x 1648 px FHD
Type: LCD IPS; eInk E INK Carta 1200
Densité: 401 ppi Very high density; 302 ppi High Density
Rapport d’aspect: 20:9; 18:9
Fonctions: Water Drop Notch, Secondary rear display, Refresh rate 120 Hz, Capacitive, Multi-touch; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: MediaTek Dimensity 7050 (MT6877); Qualcomm Snapdragon 662
CPU: 2x2.6 GHz ARM Cortex A78+6x 2.0 GHz ARM Cortex A55; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 6 nm; 11 nm
Fréquence: 2.6 GHz; 2 GHz
GPU: Mali-G68 MC4; Qualcomm Adreno 610
RAM: 16 GB; 8 GB
Type de RAM: RAM LPDDR5; —
64 bits: Yes; Yes

Résolution: 100 Mpx; 13 Mpx
Ouverture: ƒ/ 1.89; Unknow
Capteur: Omnivision OVA0B40; —
Taille de pixel: 0.61 µm; —
Taille du capteur: 1/1.8"; —
Flash: Dual LED; LED
Stabilisation optique: No; No
Ralenti: Yes, 120 fps; No, 30 fps
Fonctions: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 256 GB; 256 GB
Type: UFS Storage 3.1; —
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.2 mm 170.9 mm 18.7 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Poids: 388 g; 183 g
Matériaux: TPU , Rugged Smartphone; Plastic
Couleurs: Black; Black
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; —
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 74 %; 76 %

Système d’exploitation: Android 14 Upside-down cake Android 14; Android 12 Snow Cone Android 12
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.1
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS
USB: —; USB Type-C

5G: n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)