Cubot KingKong ACE 2 vs hisense A9 Pro

En bref

Marque: Cubot; HiSense
Date de sortie: novembre 2024, il y a 1 ans et 8 mois; mars 2023, il y a 3 ans et 4 mois
AnTuTu: 221.000 Antutu v10 Overall performance better than 56% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Taille: 6.56"; 6.1"
Résolution: 720 x 1612 px HD+; 824 x 1648 px FHD
Type: LCD IPS; eInk E INK Carta 1200
Densité: 401 ppi Very high density; 302 ppi High Density
Rapport d’aspect: 20:9; 18:9
Fonctions: Water Drop Notch, Refresh rate 120 Hz, Capacitive, Multi-touch; Water Drop Notch, Capacitive, Multi-touch, Frameless

Chipset: MediaTek Helio G85 (MT6769V/CZ); Qualcomm Snapdragon 662
CPU: 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Type de CPU: Octa-Core; Octa-Core
Gravure: 12 nm; 11 nm
Fréquence: 2 GHz; 2 GHz
GPU: Arm Mali-G52 MC2 950MHz; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
64 bits: Yes; Yes

Résolution: 48 Mpx; 13 Mpx
Ouverture: ƒ/ 1.89; Unknow
Taille de pixel: 0.61 µm; —
Flash: Dual LED; LED
Stabilisation optique: No; No
Ralenti: Yes, 120 fps; No, 30 fps
Fonctions: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacité: 128 GB; 256 GB
Emplacement SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 81.8 mm 173.9 mm 12.7 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Poids: 283 g; 183 g
Matériaux: TPU , Rugged Smartphone; Plastic
Couleurs: Green Orange; Black
Résistance eau/poussière: IP68, IP69 , MIL-STD-810H; —
Résistance aux chutes: Class A B C D E 270 drops without defects; —
Réparabilité: Class A B C D E; —
Surface utile: 74 %; 76 %

Système d’exploitation: Android 14 Upside-down cake Android 14; Android 12 Snow Cone Android 12
Services Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1
Profils Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fonctions Wi-Fi: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot
Fonctions USB: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS
USB: —; USB Type-C

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)