hotwav T7S vs UmiDigi G9x

At a glance

Brand: Hotwav; UMiDIGI
Release date: January 2025, 1 years 4 months ago; June 2025, 11 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 154.000 Antutu v10 Overall performance better than 53% of devices

Size: 6.52"; 6.75"
Resolution: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 407 ppi Very high density; 260 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 90 Hz, Brightnes 450 cd/m² (typ), 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Spreadtrum Unisoc SC9863A
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Cortex A55 1.6 GHz + 4x Cortex A55 1.2 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 28 nm
Frequency: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; PowerVR GE8322
RAM: 4 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 21 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 1.8
Sensor: Sony Exmor; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 128 GB
Type: eMMC 5.1 Storage; —
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 78.0 mm 168.3 mm 8.1 mm Print 3D Model
Weight: 310 g; 190 g
Materials: Rugged Smartphone, Plastic , Faux leather; Plastic
Colors: Black Green; Black Silver Green
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 71 %; 83 %

Operating system: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B20 (800), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)