hotwav T7S vs Tecno Spark 40 Pro

At a glance

Brand: Hotwav; Tecno
Release date: January 2025, 1 years 5 months ago; July 2025, 11 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 410.000 Antutu v10 Overall performance better than 67% of devices

Size: 6.52"; 6.78"
Resolution: 1080 x 2460 px FHD+; 1225 x 2720 px QHD
Type: LCD IPS; AMOLED
Density: 407 ppi Very high density; 440 ppi Very high density
Aspect ratio: 21:9; 20:9
Features: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 144 Hz, Scratch resistant, Corning Gorilla Glass 7i, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; MediaTek Helio G100
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x2.2GHz Cortex A76 + 6x2GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; Arm Mali-G57 MC2
RAM: 4 GB; 8 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 21 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Sensor: Sony Exmor; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash

Capacity: 128 GB; 128 GB
Type: eMMC 5.1 Storage; —
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 75.9 mm 163.7 mm 6.7 mm Print 3D Model
Weight: 310 g; 170 g
Materials: Rugged Smartphone, Plastic , Faux leather; Polycarbonate
Colors: Black Green; Black Blue Gray Green
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP64
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 84 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.3
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)