hotwav T7S vs Oukitel WP55S

At a glance

Brand: Hotwav; Oukitel
Release date: January 2025, 1 years 4 months ago; December 2025, 5 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 408.900 Antutu v10 Overall performance better than 66% of devices

Size: 6.52"; 6.58"
Resolution: 1080 x 2460 px FHD+; 1080 x 2408 px FHD+
Type: LCD IPS; AMOLED
Density: 407 ppi Very high density; 401 ppi Very high density
Aspect ratio: 21:9; 20:9
Features: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Water Drop Notch, Refresh rate 120 Hz, Scratch resistant, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: MediaTek MT8788V; MediaTek Helio G100
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x2.2GHz Cortex A76 + 6x2GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; Arm Mali-G57 MC2
RAM: 4 GB; 12 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 21 Mpx; 64 Mpx
Aperture: Unknow; ƒ/ 1.89
Sensor: Sony Exmor; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash, Night Mode, Night Vision

Capacity: 128 GB; 512 GB
Type: eMMC 5.1 Storage; —
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 81.0 mm 172.2 mm 15.3 mm Print 3D Model
Weight: 310 g; 368 g
Materials: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Plastic
Colors: Black Green; Black White Red
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 74 %

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.2 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax)
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)