hotwav T7S vs Huawei nova Y73

At a glance

Brand: Hotwav; Huawei
Release date: January 2025, 1 years 4 months ago; May 2025, 1 years ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 223.900 Antutu v8 Overall performance better than 56% of devices

Size: 6.52"; 6.67"
Resolution: 1080 x 2460 px FHD+; 720 x 1604 px HD+
Type: LCD IPS; TFT LCD (IPS)
Density: 407 ppi Very high density; 264 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Peak brightness - 1000 cd/m², 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Huawei HiSilicon KIRIN 710A
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x Cortex A73 2.2 GHz + 4x Cortex A53 1.7 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2.2 GHz
GPU: Mali-G72 MP3; ARM Mali-G51 MP4
RAM: 4 GB; 8 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 21 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Sensor: Sony Exmor; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Quadruple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 128 GB
Type: eMMC 5.1 Storage; —
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.6 mm 166.0 mm 8.2 mm Print 3D Model
Weight: 310 g; 203 g
Materials: Rugged Smartphone, Plastic , Faux leather; Plastic
Colors: Black Green; Black Blue
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 84 %

Operating system: Android 13 Tiramisu Android 13; Android 12 Snow Cone EMUI 12 (Android)
Google services: With Google Mobile Services; Without Google Mobile services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.1 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); EDR (Enhanced Data Rate), LE (Low Energy), SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11b , 802.11g , 802.11n
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, QZSS

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B13 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)