hotwav T7 vs Oukitel G3

At a glance

Brand: Hotwav; Oukitel
Release date: July 2024, 1 years 11 months ago; August 2025, 10 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 141.000 Antutu v9 Overall performance better than 53% of devices

Size: 6.6"; 6"
Resolution: 1080 x 2460 px FHD+; 576 x 1152 px LowRes
Type: LCD IPS; LCD IPS
Density: 407 ppi Very high density; 215 ppi Medium Density
Aspect ratio: 21:9; 18:9
Features: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Without Notch, Brightnes 450 cd/m² (typ), 1000:1 contrast ratio, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: MediaTek MT8788V; Unisoc Tiger T310
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 1 x ARM Cortex A75 2.0Ghz + 3 x ARM Cortex A55 1.8Ghz
CPU type: Octa-Core; Quad-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; —
RAM: 4 GB; 4 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 21 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.2
Sensor: Sony Exmor; Omnivision OV13853
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Pixel size: —; 1.12 µm
Sensor size: —; 1/3.06"

Capacity: 128 GB; 128 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 81.1 mm 166.0 mm 15.0 mm Print 3D Model
Weight: 292 g; 300 g
Materials: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Polycarbonate
Colors: Black Orange; Black Red Green
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68
Usable surface: 71 %; 69 %
Drop resistance: —; Class A B C D E 270 drops without defects
Repairability: —; Class A B C D E

Operating system: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)