hotwav T7 Pro vs Xiaomi Redmi 13

At a glance

Brand: Hotwav; Xiaomi
Release date: June 2024, 2 years ago; May 2024, 2 years 1 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Size: 6.6"; 6.79"
Resolution: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Type: LCD IPS; LTPS LCD
Density: 407 ppi Very high density; 388 ppi High Density
Aspect ratio: 21:9; 19.5:9
Features: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; MediaTek Helio G91
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Arm Mali-G52 MC2 850MHz
RAM: 6 GB; 6 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 64 Mpx; 108 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; Quad LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 128 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Weight: 292 g; 198 g
Materials: Rugged Smartphone, Plastic , Faux leather; Plastic , P2i Nano coating , Splash resistant design
Colors: Black Orange; Black Pink Cyan
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 94 %

Operating system: Android 13 Tiramisu Android 13; Android 14 Upside-down cake HyperOS (Android 14)
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.4 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)