hotwav T7 Pro vs Xiaomi Redmi 10C

At a glance

Brand: Hotwav; Xiaomi
Release date: June 2024, 2 years ago; March 2022, 4 years 3 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 248.639 Antutu v9 Overall performance better than 58% of devices

Size: 6.6"; 6.71"
Resolution: 1080 x 2460 px FHD+; 720 x 1650 px HD+
Type: LCD IPS; LCD IPS
Density: 407 ppi Very high density; 268 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, Scratch resistant, Corning Gorilla Glass, 2.5D glass screen, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Qualcomm Snapdragon 680 (SM6225)
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4x2.4 GHz Kryo 265 Gold + 4x1.9GHz Kryo 265 Silver
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.4 GHz
GPU: Mali-G72 MP3; Adreno 610
RAM: 6 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 64 Mpx; 50 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; Yes, 120 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung S5KJN1
Pixel size: —; 0.64 µm
Sensor size: —; 1/2.76"

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.6 mm 169.6 mm 8.3 mm Print 3D Model
Weight: 292 g; 190 g
Materials: Rugged Smartphone, Plastic , Faux leather; Plastic
Colors: Black Orange; Blue Gray Green
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 83 %

Operating system: Android 13 Tiramisu Android 13; Android 11 Red Velvet Cake MIUI V13 (Android 11)
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)