hotwav T7 Pro vs philips S6310

At a glance

Brand: Hotwav; Philips
Release date: June 2024, 2 years ago; November 2024, 1 years 7 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 237.000 Antutu v10 Overall performance better than 57% of devices

Size: 6.6"; 6.56"
Resolution: 1080 x 2460 px FHD+; 720 x 1612 px HD+
Type: LCD IPS; LCD IPS
Density: 407 ppi Very high density; 269 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, Capacitive, Multi-touch, Frameless

Chipset: MediaTek MT8788V; Unisoc Tiger T606
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; ARM Mali-G57
RAM: 6 GB; 4 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 64 Mpx; 50 Mpx
Aperture: Unknow; Unknow
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 128 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.0 mm 163.5 mm 8.5 mm Print 3D Model
Weight: 292 g; 200 g
Materials: Rugged Smartphone, Plastic , Faux leather; Plastic
Colors: Black Orange; Black
Water/dust resistance: IP68, IP69 , MIL-STD-810H; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 71 %; 83 %

Operating system: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 4.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800), B28a (700), B40 (TDD 2300)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B8 (900)