hotwav T7 Pro vs Oukitel WP36

At a glance

Brand: Hotwav; Oukitel
Release date: June 2024, 1 years 11 months ago; April 2024, 2 years 1 months ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 255.000 Antutu v10 Overall performance better than 60% of devices

Size: 6.6"; 6.52"
Resolution: 1080 x 2460 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 407 ppi Very high density; 269 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Water Drop Notch, Brightnes 400 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: MediaTek MT8788V; MediaTek MT8788V
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Mali-G72 MP3
RAM: 6 GB; 8 GB
RAM type: LPDDR4X RAM; LPDDR4 RAM
64-bit: Yes; Yes

Resolution: 64 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.2
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX135 Exmor RS
Pixel size: —; 1.12 µm
Sensor size: —; 1/3.06"

Capacity: 256 GB; 128 GB
Type: eMMC 5.1 Storage; —
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 80.7 mm 172.2 mm 19.1 mm Print 3D Model
Weight: 292 g; 394 g
Materials: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Metal
Colors: Black Orange; Black
Water/dust resistance: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 71 %; 73 %

Operating system: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900), B34 (TD 2000), B39 (TD 1900+)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), B2 (1900), B3 (1800), B5 (850), B8 (900)