hotwav Note 18 Pro vs hotwav T7

At a glance

Brand: Hotwav; Hotwav
Release date: November 2025, 5 months ago; July 2024, 1 year ago
AnTuTu: 308.681 Antutu v10 Overall performance better than 61% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 7.2"; 6.6"
Resolution: 720 x 1560 px HD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 239 ppi Medium Density; 407 ppi Very high density
Aspect ratio: 21:9; 21:9
Features: Water Drop Notch, Refresh rate 120 Hz, Brightnes 450 cd/m² (typ), 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch, Frameless, In-cell; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Chipset: Unisoc Tiger T615 (T7250); MediaTek MT8788V
CPU: 2 x ARM Cortex A75 1.8Ghz + 6 x ARM Cortex A55 1.6Ghz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 1.8 GHz; 2 GHz
GPU: Mali-G57 MP1; Mali-G72 MP3
RAM: 6 GB; 4 GB
64-bit: Yes; Yes
RAM type: —; LPDDR4X RAM

Resolution: 50 Mpx; 21 Mpx
Aperture: ƒ/ 1.8; Unknow
Sensor: Samsung; Sony Exmor
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 128 GB; 128 GB
Type: eMMC 5.1 Storage; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 84.0 mm 176.2 mm 8.6 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 225 g; 292 g
Materials: Plastic; Rugged Smartphone, Plastic , Faux leather
Colors: Blue Gold Green; Black Orange
Drop resistance: Class A B C D E 180 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 87 %; 71 %
Water/dust resistance: —; IP68, IP69 , MIL-STD-810H

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.2; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)