hotwav Note 16 vs Oukitel G3

At a glance

Brand: Hotwav; Oukitel
Release date: September 2025, 8 months ago; August 2025, 9 months ago
AnTuTu: 235.000 Antutu v10 Overall performance better than 57% of devices; 141.000 Antutu v9 Overall performance better than 53% of devices

Size: 6.9"; 6"
Resolution: 720 x 1640 px HD+; 576 x 1152 px LowRes
Type: LCD IPS; LCD IPS
Density: 260 ppi Medium Density; 215 ppi Medium Density
Aspect ratio: 20:9; 18:9
Features: Water Drop Notch, Brightnes 450 cd/m² (typ), Max brightness HBM - 500 cd/m², 2.5D curved glass screen, Panda glass, Capacitive, Multi-touch; Without Notch, Brightnes 450 cd/m² (typ), 1000:1 contrast ratio, Corning Gorilla Glass 5, Capacitive, Multi-touch

Chipset: Unisoc Tiger T606; Unisoc Tiger T310
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 1 x ARM Cortex A75 2.0Ghz + 3 x ARM Cortex A55 1.8Ghz
CPU type: Octa-Core; Quad-Core
Process: 12 nm; 12 nm
Frequency: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; —
RAM: 4 GB; 4 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 13 Mpx; 13 Mpx
Aperture: ƒ/ 1.8; ƒ/ 2.2
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Omnivision OV13853
Pixel size: —; 1.12 µm
Sensor size: —; 1/3.06"

Capacity: 64 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 78.3 mm 171.8 mm 8.2 mm Print 3D Model; 81.1 mm 166.0 mm 15.0 mm Print 3D Model
Weight: 208 g; 300 g
Materials: Plastic; Rugged Smartphone, Polycarbonate
Colors: Black Blue Gold; Black Red Green
Drop resistance: Class A B C D E 57 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 82 %; 69 %
Water/dust resistance: —; IP68

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)