hotwav Note 13 Max vs philips S6210

At a glance

Brand: Hotwav; Philips
Release date: December 2024, 1 years 6 months ago; November 2025, 7 months ago
AnTuTu: 256.000 Antutu v10 Overall performance better than 60% of devices; 237.000 Antutu v10 Overall performance better than 57% of devices

Size: 6.8"; 6.56"
Resolution: 720 x 1640 px HD+; 720 x 1612 px HD+
Type: LCD IPS; LCD IPS
Density: 409 ppi Very high density; 269 ppi Medium Density
Aspect ratio: 19.5:9; 20:9
Features: Hole-punch Notch, Refresh rate 90 Hz, Max brightness HBM - 500 cd/m², 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Panda glass, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, Capacitive, Multi-touch, Frameless

Chipset: Unisoc Tiger T606; Unisoc Tiger T606
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 1.6 GHz; 1.6 GHz
GPU: ARM Mali-G57; ARM Mali-G57
RAM: 6 GB; 3 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 48 Mpx; 13 Mpx
Aperture: ƒ/ 1.8; Unknow
Sensor: Omnivision OV48B; —
Pixel size: 0.80 µm; —
Sensor size: 1/2"; —
Flash: LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacity: 256 GB; 64 GB
Type: UFS Storage 2.2; eMMC 5.1 Storage
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 78.0 mm 173.0 mm 9.2 mm Print 3D Model; 75.6 mm 163.6 mm 8.5 mm Print 3D Model
Weight: 223 g; 200 g
Materials: Rugged Smartphone, Polycarbonate; Plastic
Colors: Black Gold Purple; Black
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 70 %; 83 %

Operating system: Android 14 Upside-down cake Android 14; Android 14 Upside-down cake Android 14
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 4.2
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B7 (2600), B8 (900), B20 (800), B28a (700), B40 (TDD 2300)
3G: B1 (2100), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B3 (1800), B8 (900)