hotwav Cyber 13 Pro vs UmiDigi G3

At a glance

Brand: Hotwav; UMiDIGI
Release date: October 2023, 2 years 7 months ago; May 2023, 3 years ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Size: 6.6"; 6.52"
Resolution: 1080 x 2408 px FHD+; 720 x 1600 px HD+
Type: LCD IPS; LCD IPS
Density: 396 ppi High Density; 269 ppi Medium Density
Aspect ratio: 21:9; 20:9
Features: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Water Drop Notch, 2.5D curved glass screen, Capacitive, Multi-touch

Chipset: Unisoc Tiger T619; MediaTek Helio A22 (MT6761)
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 4x Cortex A53 2.0 GHz
CPU type: Octa-Core; Quad-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: GPU ARM Mali-G57; IMG PowerVR GE-class GPU
RAM: 12 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 64 Mpx; 13 Mpx
Aperture: Unknow; ƒ/ 2.2
Flash: Dual LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode

Capacity: 256 GB; 64 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 75.9 mm 164.0 mm 8.8 mm Print 3D Model
Weight: 380 g; 192 g
Materials: TPU , Rugged Smartphone; Plastic
Colors: Black; Black Green Violet
Water/dust resistance: IP68, MIL-STD-810G , IP69; —
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 70 %; 82 %

Operating system: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 5.0
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), HID (Human Interface Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)