hotwav Cyber 13 Pro vs iiif150 Air1 Pro

At a glance

Brand: Hotwav; iiiF150
Release date: October 2023, 2 years 8 months ago; June 2022, 4 years ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 160.000 Antutu v10 Overall performance better than 54% of devices

Size: 6.6"; 6.5"
Resolution: 1080 x 2408 px FHD+; 1080 x 2400 px FHD+
Type: LCD IPS; LCD IPS
Density: 396 ppi High Density; 405 ppi Very high density
Aspect ratio: 21:9; 20:9
Features: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Hole-punch Notch, LED Notifications, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T619; MediaTek Helio G37
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 8x2.3GHz Cortex A53
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2.3 GHz
GPU: GPU ARM Mali-G57; PowerVR GE832
RAM: 12 GB; 6 GB
RAM type: LPDDR4X RAM; —
64-bit: Yes; Yes

Resolution: 64 Mpx; 45 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: Dual LED; Triple LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Vision

Capacity: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 81.6 mm 171.0 mm 11.3 mm Print 3D Model
Weight: 380 g; 272 g
Materials: TPU , Rugged Smartphone; Rugged Smartphone, Polycarbonate , Titanium
Colors: Black; Black Orange
Water/dust resistance: IP68, MIL-STD-810G , IP69; IP68, MIL-STD-810G , IP69
Drop resistance: Class A B C D E 270 drops without defects; —
Repairability: Class A B C D E; —
Usable surface: 70 %; 73 %

Operating system: Android 13 Tiramisu Android 13; Android 11 Red Velvet Cake Android 11
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B7 (2600), B8 (900), B19 (800), B20 (800)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)