hotwav Cyber 13 Pro vs hotwav T7S

At a glance

Brand: Hotwav; Hotwav
Release date: October 2023, 2 years ago; January 2025, 1 year ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Size: 6.6"; 6.52"
Resolution: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Type: LCD IPS; LCD IPS
Density: 396 ppi High Density; 407 ppi Very high density
Aspect ratio: 21:9; 21:9
Features: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Water Drop Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Dragontrail glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T619; MediaTek MT8788V
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 12 nm
Frequency: 2 GHz; 2 GHz
GPU: GPU ARM Mali-G57; Mali-G72 MP3
RAM: 12 GB; 4 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 64 Mpx; 21 Mpx
Aperture: Unknow; Unknow
Flash: Dual LED; LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacity: 256 GB; 128 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Type: —; eMMC 5.1 Storage

Dimensions: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 380 g; 310 g
Materials: TPU , Rugged Smartphone; Rugged Smartphone, Plastic , Faux leather
Colors: Black; Black Green
Water/dust resistance: IP68, MIL-STD-810G , IP69; IP68, IP69 , MIL-STD-810H
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 70 %; 71 %

Operating system: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 5.0 LELow energy consumption
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)