hotwav Cyber 13 Pro vs hotwav Cyber 15

At a glance

Brand: Hotwav; Hotwav
Release date: October 2023, 2 years 7 months ago; May 2024, 2 years ago
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Size: 6.6"; 6.6"
Resolution: 1080 x 2408 px FHD+; 1080 x 2408 px FHD+
Type: LCD IPS; LCD IPS
Density: 396 ppi High Density; 396 ppi High Density
Aspect ratio: 21:9; 21:9
Features: Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Chipset: Unisoc Tiger T619; MediaTek Helio G99 (MT6789)
CPU: 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
CPU type: Octa-Core; Octa-Core
Process: 12 nm; 6 nm
Frequency: 2 GHz; 2.2 GHz
GPU: GPU ARM Mali-G57; Mali-G57 MC2
RAM: 12 GB; 12 GB
RAM type: LPDDR4X RAM; LPDDR4X RAM
64-bit: Yes; Yes

Resolution: 64 Mpx; 200 Mpx
Aperture: Unknow; ƒ/ 1.8
Flash: Dual LED; Dual LED
Optical stabilization: No; No
Slow motion: No, 30 fps; No, 30 fps
Features: Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung S5KHP3SP
Sensor size: —; 1/1.4"

Capacity: 256 GB; 256 GB
SD slot: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensions: 84.2 mm 176.8 mm 16.8 mm Print 3D Model; 82.3 mm 174.6 mm 12.8 mm Print 3D Model
Weight: 380 g; 290 g
Materials: TPU , Rugged Smartphone; TPU , Rugged Smartphone
Colors: Black; Black
Water/dust resistance: IP68, MIL-STD-810G , IP69; IP68, MIL-STD-810G , IP69
Drop resistance: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Repairability: Class A B C D E; Class A B C D E
Usable surface: 70 %; 67 %

Operating system: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Google services: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3; Bluetooth 5.1
Bluetooth profiles: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Wi-Fi features: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
USB features: Charging, OTG; Charging, OTG
Navigation: GPS, A-GPS, GLONASS, Beidou; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B30 (2300), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)